This page informs about the optional tutorial on Friday afternoon.

Advanced Packaging

The topic of this half-day tutorial was devoted to modern packaging technologies.

Presenter: Mr. Christian VAL, 3D-Plus Company


  • Requirements to and technologies for IC packaging
  • Overview of different packaging technologies and their specific applications
  • Packaging for high reliability applications
  • Pitfalls and challenges in IC Packaging
  • Advanced 3D packaging (chip on chip / die on die / etc.)

The tutorial took place in a seminar room called "Kontaktraum" at the roof top. Please visit the venue information page for a map and how to get there.